- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 101/40 - Semiconductor devices
Patent holdings for IPC class B23K 101/40
Total number of patents in this class: 681
10-year publication summary
33
|
63
|
99
|
89
|
100
|
62
|
85
|
40
|
19
|
1
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Disco Corporation | 1745 |
84 |
Hamamatsu Photonics K.K. | 4161 |
41 |
Senju Metal Industry Co., Ltd. | 654 |
17 |
Samsung Electronics Co., Ltd. | 131630 |
15 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
15 |
Kulicke and Soffa Industries, Inc. | 292 |
15 |
Siltectra GmbH | 88 |
14 |
Samsung Display Co., Ltd. | 30585 |
11 |
Micron Technology, Inc. | 24960 |
11 |
Shinkawa Ltd. | 400 |
10 |
Applied Materials, Inc. | 16587 |
9 |
Fuji Electric Co., Ltd. | 4750 |
9 |
Nichia Corporation | 3394 |
9 |
Mitsubishi Electric Corporation | 43934 |
8 |
Jsw Aktina System, Co., Ltd. | 61 |
8 |
AmaTech Group Limited | 68 |
7 |
Corning Incorporated | 9932 |
6 |
IPG Photonics Corporation | 494 |
6 |
KEMET Electronics Corporation | 339 |
6 |
Nippon Micrometal Corporation | 126 |
6 |
Other owners | 374 |